Collegamento su wafer

it

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Collegamento su wafer

Quality:

Wafer bonding - packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation. Article “Collegamento su wafer” in Italian Wikipedia has 14.5 points for quality (as of July 1, 2025). The article contains 3 references and 8 sections.

This article has the best quality in Catalan Wikipedia. However, the most popular language version of this article is English.

Since the creation of article “Collegamento su wafer”, its content was written by 12 registered users of Italian Wikipedia and edited by 64 registered Wikipedia users in all languages.

The article is cited 3 times in Italian Wikipedia and cited 47 times in all languages.

The highest Authors Interest rank from 2001:

  • Local (Italian): #12584 in February 2013
  • Global: #207726 in April 2011

The highest popularity rank from 2008:

  • Local (Italian): #456003 in August 2012
  • Global: #638928 in September 2014

There are 5 language versions for this article in the WikiRank database (of the considered 55 Wikipedia language editions).

The quality and popularity assessment was based on Wikipédia dumps from July 1, 2025 (including revision history and pageviews for previous years).

The table below shows the language versions of the article with the highest quality.

Languages with the highest quality

#LanguageQuality gradeQuality score
1Catalan (ca)
Unió d'oblies
24.6714
2German (de)
Waferbonden
19.5619
3English (en)
Wafer bonding
16.3712
4Italian (it)
Collegamento su wafer
14.5221
5Japanese (ja)
基板接合
4.0138
More...

The following table shows the most popular language versions of the article.

Most popular in all the time

The most popular language versions of the article "Collegamento su wafer" in all the time
#LanguagePopularity awardRelative popularity
1English (en)
Wafer bonding
176 643
2German (de)
Waferbonden
72 935
3Japanese (ja)
基板接合
22 984
4Italian (it)
Collegamento su wafer
4 187
5Catalan (ca)
Unió d'oblies
68
More...

The following table shows the language versions of the article with the highest popularity in the last month.

Most popular in June 2025

The most popular language versions of the article "Collegamento su wafer" in June 2025
#LanguagePopularity awardRelative popularity
1English (en)
Wafer bonding
486
2German (de)
Waferbonden
126
3Japanese (ja)
基板接合
46
4Italian (it)
Collegamento su wafer
14
5Catalan (ca)
Unió d'oblies
3
More...

The following table shows the language versions of the article with the highest Authors’ Interest.

The highest AI

Language versions of the article "Collegamento su wafer" with the highest Authors Interest (number of authors). Only registered Wikipedia users were taken into account.
#LanguageAI awardRelative AI
1German (de)
Waferbonden
28
2English (en)
Wafer bonding
17
3Italian (it)
Collegamento su wafer
12
4Japanese (ja)
基板接合
6
5Catalan (ca)
Unió d'oblies
1
More...

The following table shows the language versions of the article with the highest Authors’ Interest in the last month.

The highest AI in June 2025

Language versions of the article "Collegamento su wafer" with the highest AI in June 2025
#LanguageAI awardRelative AI
1Catalan (ca)
Unió d'oblies
0
2German (de)
Waferbonden
0
3English (en)
Wafer bonding
0
4Italian (it)
Collegamento su wafer
0
5Japanese (ja)
基板接合
0
More...

The following table shows the language versions of the article with the highest number of citations.

The highest CI

Language versions of the article "Collegamento su wafer" with the highest Citation Index (CI)
#LanguageCI awardRelative CI
1English (en)
Wafer bonding
29
2German (de)
Waferbonden
10
3Japanese (ja)
基板接合
4
4Italian (it)
Collegamento su wafer
3
5Catalan (ca)
Unió d'oblies
1
More...

Scores

Estimated value for Wikipedia:
Italian:
Global:
Popularity in June 2025:
Italian:
Global:
Popularity in all years:
Italian:
Global:
Authors in June 2025:
Italian:
Global:
Registered authors in all years:
Italian:
Global:
Citations:
Italian:
Global:

Quality measures

Interwikis

#LanguageValue
caCatalan
Unió d'oblies
deGerman
Waferbonden
enEnglish
Wafer bonding
itItalian
Collegamento su wafer
jaJapanese
基板接合

Popularity rank trends

Best Rank Italian:
#456003
08.2012
Global:
#638928
09.2014

AI rank trends

Best Rank Italian:
#12584
02.2013
Global:
#207726
04.2011

Languages comparison

Important global interconnections (July 2024 – June 2025)

Wikipedia readers most often find their way to information on Wafer bonding from Wikipedia articles about Wafer dicing, Semiconductor wafer, Wafer-level packaging, Silicon on insulator and Optical contact bonding. Whereas reading the article about Wafer bonding people most often go to Wikipedia articles on Direct bonding, Plasma activated bonding, Surface activated bonding, Eutectic bonding and Anodic bonding.

Cumulative results of quality and popularity of the Wikipedia article

List of Wikipedia articles in different languages (starting with the most popular):

News from 21 February 2026

On 21 February 2026 in multilingual Wikipedia, Internet users most often read articles on the following topics: Jeffrey Epstein, Alysa Liu, Eric Dane, 2026 Winter Olympics, Rebecca Gayheart, Johannes Høsflot Klæbo, Wuthering Heights, amyotrophic lateral sclerosis, Andrew Mountbatten-Windsor, John F. Kennedy Jr..

In Italian Wikipedia the most popular articles on that day were: Matilde Lorenzi, Federico Tomasoni, Carolina Kostner, Festival di Sanremo 2026, Eric Dane, Quel pomeriggio di un giorno da cani, Andrea Pignataro, Simone Deromedis, Jeffrey Epstein, Dorothea Wierer.

About WikiRank

The WikiRank project is intended for automatic relative evaluation of the articles in the various language versions of Wikipedia. At the moment the service allows to compare over 44 million Wikipedia articles in 55 languages. Quality scores of articles are based on Wikipedia dumps from July, 2025. When calculating current popularity and AI of articles data from June 2025 was taken into account. For historical values of popularity and AI WikiRank used data from 2001 to 2025... More information